![The Market for High-Brightness LEDs in Lighting Applications: Market Review and Forecast 2012 The Market for High-Brightness LEDs in Lighting Applications: Market Review and Forecast 2012](https://cdn11.bigcommerce.com/s-45rfrfl4/images/stencil/300x300/products/76/262/sureport_hbledmarket2012__39810.1393530273.jpg?c=2)
Chip-on-board, or COB, packages contain a number of chips attached directly to the substrate, then packaged together by silica gel, epoxy resin, or other materials. COB assemblies improve package performance and are a preferred application by process engineers. This report looks at the COB packages that were specifically sold as COB, not simply manufactured in house and put into an end product.